Packaging of 10-k v double-side cooled silicon carbide diode modular with tin substarates coated by a nonlinear resistive polymer-nanoparticle composite / Zichen Zhang, Shengchang Lu, Boyan Wang, Yuhao Zhang, Nick Yun, Woongji Sung, Khai d.t. Ngo, and Guo-Quan Lu.
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TextPublication details: New York ; The Institute of Electrical and Electronics Engineers, Inc., December 2022.Description: volume 37, pages 14462-14470, illustrationSubject(s): DDC classification: - DPer 621.317 Ie21 December 2022 v.37 n. 12 part 1&2.
| Item type | Current library | Collection | Call number | Status | Notes | Date due | Barcode | |
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Periodicals
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UM Digos College - LIC | Periodicals | DPer 621.317 Ie21 December 2022 v.37 n. 12 part 1&2. (Browse shelf(Opens below)) | Not for loan | Periodical Article |
IEEE Transactions on Power Electronics, v. 37 n. 12, pages 14462-14470, December 2022.
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