Packaging of 10-k v double-side cooled silicon carbide diode modular with tin substarates coated by a nonlinear resistive polymer-nanoparticle composite /
Zhang, Zichen.
Packaging of 10-k v double-side cooled silicon carbide diode modular with tin substarates coated by a nonlinear resistive polymer-nanoparticle composite / Zichen Zhang, Shengchang Lu, Boyan Wang, Yuhao Zhang, Nick Yun, Woongji Sung, Khai d.t. Ngo, and Guo-Quan Lu. - New York ; The Institute of Electrical and Electronics Engineers, Inc., December 2022. - volume 37, pages 14462-14470, illustration.
IEEE Transactions on Power Electronics, v. 37 n. 12, pages 14462-14470, December 2022.
Module thermal management and insulation.
Substrates.
polymer-nanoparticle composite.
DPer 621.317 Ie21 December 2022 v.37 n. 12 part 1&2.
Packaging of 10-k v double-side cooled silicon carbide diode modular with tin substarates coated by a nonlinear resistive polymer-nanoparticle composite / Zichen Zhang, Shengchang Lu, Boyan Wang, Yuhao Zhang, Nick Yun, Woongji Sung, Khai d.t. Ngo, and Guo-Quan Lu. - New York ; The Institute of Electrical and Electronics Engineers, Inc., December 2022. - volume 37, pages 14462-14470, illustration.
IEEE Transactions on Power Electronics, v. 37 n. 12, pages 14462-14470, December 2022.
Module thermal management and insulation.
Substrates.
polymer-nanoparticle composite.
DPer 621.317 Ie21 December 2022 v.37 n. 12 part 1&2.