Improved measurement accuracy for junction-to-case thermal resistance of Gan HEMT packages by gate-to-gate electrical interface materials / Shengchang Lu, Zichen Zhang, Cyril Buttay, Khai D. T. Ngo, and Guo-Quan Lu.
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TextPublication details: New York ; The Institute of Electrical and Electronics Engineers, Inc. , June 2022.Description: Volume 37, pages 6285-6289 : illustration ; 29 cmDDC classification: - DPer 621.317 Ie21 June 2022 v. 37 n. 6
| Item type | Current library | Collection | Call number | Status | Notes | Date due | Barcode | |
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UM Digos College - LIC | Periodicals | DPer 621.317 Ie21 June 2022 v.37 n. 6 (Browse shelf(Opens below)) | Available | Periodical Article |
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IEEE Transactions on Power Electronics, vol. 37, no. 6, pages 6285-6289, June 2022.
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