000 01394nam a22003017a 4500
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040 _c0
082 _aDPer 621.317 Ie21 December 2022 v.37 n. 12 part 1&2.
100 _aZhang, Zichen.
_eauthor.
_960369
245 _aPackaging of 10-k v double-side cooled silicon carbide diode modular with tin substarates coated by a nonlinear resistive polymer-nanoparticle composite /
_cZichen Zhang, Shengchang Lu, Boyan Wang, Yuhao Zhang, Nick Yun, Woongji Sung, Khai d.t. Ngo, and Guo-Quan Lu.
260 _aNew York ;
_bThe Institute of Electrical and Electronics Engineers, Inc.,
_cDecember 2022.
300 _avolume 37, pages 14462-14470,
_billustration.
500 _aIEEE Transactions on Power Electronics, v. 37 n. 12, pages 14462-14470, December 2022.
650 0 _aModule thermal management and insulation.
_966068
650 0 _aSubstrates.
_966069
650 0 _apolymer-nanoparticle composite.
_966070
700 _aZhang, Zichen.
_eauthor.
_960369
700 _a Lu, Shengchang.
_eauthor.
_960370
700 _aWang, Boyan.
_eauthor.
_960371
700 _aZhang, Yuhao.
_eauthor.
_960372
700 _aYun, Nick.
_eauthor.
_960373
700 _aSung, Woongji.
_eauthor.
_960374
700 _aNgo, Khai d.t.
_eauthor.
_960375
700 _aLu, Guo-Quan.
_eauthor.
_960376
942 _2ddc
_cPER
999 _c21395
_d21395