| 000 | 01151nam a22002537a 4500 | ||
|---|---|---|---|
| 003 | OSt | ||
| 005 | 20251002180129.0 | ||
| 008 | 240403b ||||| |||| 00| 0 eng d | ||
| 040 | _c0 | ||
| 082 | _aDPer 621.317 Ie21 October 2022 v. 37 n. 10 | ||
| 100 |
_aKuring, Carsten. _eauthor. _955966 |
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| 245 |
_aGaN-based multichip half-bridge power module integrated on high-voltage AIN ceramic substrate / _cCarsten Kuring, Michaela Wolf, Xiaomeng Geng, Oliver Hilt, Jan Böcker, Joachim Würfl, and Sibylle Dieckerhoff. |
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| 260 |
_aNew York ; _bThe Institute of Electrical and Electronics Engineers, Inc. , _cOctober 2022. |
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| 300 |
_aVolume 37, pages 11896-11910 : _billustration ; _c28 cm. |
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| 500 | _aIEEE Transactions on Power Electronics, v. 37, n. 10, pages 11896-11910, October 2022. | ||
| 700 |
_aKuring, Carsten. _eauthor. _955966 |
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| 700 |
_aWolf, Michaela. _eauthor. _955967 |
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| 700 |
_aGeng, Xiaomeng. _eauthor. _955968 |
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| 700 |
_aHilt, Oliver. _eauthor. _955969 |
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| 700 |
_aBöcker, Jan. _eauthor. _955970 |
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| 700 |
_aWürfl, Joachim. _eauthor. _955971 |
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| 700 |
_aDieckerhoff, Sibylle. _eauthor. _955972 |
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| 942 |
_2ddc _cPER |
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| 999 |
_c19993 _d19993 |
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