| 000 | 00978nam a22002297a 4500 | ||
|---|---|---|---|
| 003 | OSt | ||
| 005 | 20251001163315.0 | ||
| 008 | 240403b ||||| |||| 00| 0 eng d | ||
| 040 | _c0 | ||
| 082 | _aDPer 621.381 Ie21 October 2022 v. 37 n. 10 | ||
| 100 |
_aXu, Mengqi. _eauthor. _955787 |
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| 245 |
_aLumped thermal coupling model of multichip power module enabling case temperature as reference node / _cMengqi Xu, Ke Ma, Xu Cai, Gongzheng Cao, and Yhalin Zhang. |
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| 260 |
_aNew York ; _bThe Institute of Electrical and Electronics Engineers, Inc. , _cOctober 2022. |
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| 300 |
_aVolume 37, pages 11502-11506 : _billustration ; _c28 cm. |
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| 500 | _aIEEE Transactions on Power Electronics, v. 37, n. 10, pages 11502-11506, October 2022. | ||
| 700 |
_aXu, Mengqi. _eauthor. _955787 |
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| 700 |
_aMa, Ke. _eauthor. _955788 |
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| 700 |
_aCai, Xu. _eauthor. _955789 |
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| 700 |
_aCao, Gongzheng. _eauthor. _955790 |
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| 700 |
_aZhang, Yhalin. _eauthor. _955791 |
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| 942 |
_2ddc _cPER |
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| 999 |
_c19955 _d19955 |
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