| 000 | 01086nam a22002537a 4500 | ||
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| 003 | OSt | ||
| 005 | 20250929155248.0 | ||
| 008 | 240315b ||||| |||| 00| 0 eng d | ||
| 040 | _c0 | ||
| 082 | _aDPer 621.381 In821 August 2022 v. 37 n. 8 | ||
| 100 |
_aHu, Zed.ng _eauthor. _954898 |
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| 245 |
_aMonitoring power module solder degradation from heat dissipation in two opposite directions / _cZedong Hu, Borong Hu, Li Ran, Peter J. Tavner, Hua Kong, Philip A. Mawby, and Ruizhu Wu. |
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| 260 |
_aNew York ; _bThe Institute of Electrical and Electronics Engineers, Inc. , _cAugust 2022. |
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| 300 |
_aVolume 37, pages 9754-9766 : _billustration ; _c28 cm. |
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| 500 | _aIEEE Transitions on Power Electronics, v. 37 n. 8, pages 9754-9766, August 2022. | ||
| 700 |
_aHu, Zedong _eauthor. _954899 |
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| 700 |
_aHu, Borong. _eauthor. _954900 |
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| 700 |
_aRan, Li. _eauthor. _954901 |
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| 700 |
_aTavner, Peter J. _eauthor. _954902 |
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| 700 |
_aKong, Hua. _eauthor. _954903 |
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| 700 |
_aMawby, Philip A. _eauthor. _954904 |
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| 700 |
_aWu, Ruizhu. _eauthor. _954905 |
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| 942 |
_2ddc _cPER |
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| 999 |
_c19731 _d19731 |
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