000			00948nam a22002177a 4500
003			OSt
005			20250827175140.0
008			240313b ||||| |||| 00| 0 eng d
040			_c0
082			_aDPer 621.317 Ie21 July 2022 v. 37 n. 7
100			_aChen, Jie. _eauthor. _954410
245			_aJunction-to-case thermal resistance measurement and analysis of press-pack IGBTs under double-side cooling condition / _cJie Chen, Erping Deng, Yiming Zhang, and Yongzhang Huang.
260			_aNew York ; _bThe Institute of Electrical and Electronics Engineers, Inc. , _cJuly 2022.
300			_avolume 37, pages 8543-8553 : _billustration ; _c28 cm.
500			_aIEEE Transactions on Power Electronics, vol. 37, no. 7, pages 8543-8553, July 2022.
700			_aChen, Jie. _eauthor. _954410
700			_aDeng, Erping. _eauthor. _954411
700			_aZhang, Yiming. _eauthor. _954412
700			_aHuang, Yongzhang. _eauthor. _954413
942			_2ddc _cPER
999			_c19621 _d19621