| 000 | 01113nam a22002537a 4500 | ||
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| 003 | OSt | ||
| 005 | 20250827105939.0 | ||
| 008 | 240308b ||||| |||| 00| 0 eng d | ||
| 040 | _c0 | ||
| 082 | _aDPer 621.317 Ie21 July 2022 v. 37 n. 7 | ||
| 100 |
_aWang, Laili. _eauthor. _954163 |
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| 245 |
_aCu clip-bonding method with optimized source inductance for current balancing in multichip MOSFET power module / _cLaili Wang, Tongyu Zhang, Fengtao Yang, Dingkun Ma, Cheng Zhao, Yunqing Pei, and Yongmei Gan. |
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| 260 |
_aNew York ; _bThe Institute of Electrical and Electronics Engineers, Inc. , _cJuly 2022. |
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| 300 |
_avolume 37, pages 7952-7964 : _billustration ; _c28 cm. |
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| 500 | _aIEEE Transactions on Power Electronics, vol. 37, no. 7, pages 7952-7964, July 2022. | ||
| 700 |
_aWang, Laili. _eauthor. _954163 |
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| 700 |
_aZhang, Tongyu. _eauthor. _954164 |
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| 700 |
_aYang, Fengtao. _eauthor. _954165 |
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| 700 |
_aMa, Dingkun. _eauthor. _954166 |
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| 700 |
_aZhao, Cheng. _eauthor. _954167 |
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| 700 |
_aPei, Yunqing. _eauthor. _954168 |
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| 700 |
_aGan, Yongmei. _eauthor. _954169 |
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| 942 |
_2ddc _cPER |
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| 999 |
_c19560 _d19560 |
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