| 000 | 01169nam a22002657a 4500 | ||
|---|---|---|---|
| 003 | OSt | ||
| 005 | 20250923093606.0 | ||
| 008 | 240301b ||||| |||| 00| 0 eng d | ||
| 040 | _c0 | ||
| 082 | _aDPer 621.317 Ie21 June 2022 v. 37 n. 6 | ||
| 100 |
_aChen, Yu. _eauthor. _953861 |
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| 245 |
_aThermal mitigation and optimization via multitier bond wire layout for IGBT modules considering multicellular electro-thermal effect / _cYu Chen, Qiang Wu, Chengmin Li, Haoze Luo, Yuanye Xia, Qinqin Yin, Wuhua Li, and Xiangning He. |
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| 260 |
_aNew York ; _bThe Institute of Electrical and Electronics Engineers, Inc. , _cJune 2022. |
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| 300 |
_aVolume 37, pages 7299-7314 : _billustration ; _c29 cm. |
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| 500 | _aIEEE Transactions on Power Electronics, vol. 37, no. 6, pages 7299-7314, June 2022. | ||
| 700 |
_aChen, Yu. _eauthor. _953861 |
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| 700 |
_aWu, Qiang. _eauthor. _953862 |
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| 700 |
_aLi, Chengmin. _eauthor. _953863 |
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| 700 |
_aLuo, Haoze. _eauthor. _953864 |
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| 700 |
_aXia, Yuanye. _eauthor. _953865 |
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| 700 |
_aYin, Qinqin. _eauthor. _953866 |
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| 700 |
_aLi, Wuhua. _eauthor. _953867 |
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| 700 |
_aHe, Xiangning. _eauthor. _953868 |
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| 942 |
_2ddc _cPER |
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| 999 |
_c19495 _d19495 |
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