000 01169nam a22002657a 4500
003 OSt
005 20250923093606.0
008 240301b ||||| |||| 00| 0 eng d
040 _c0
082 _aDPer 621.317 Ie21 June 2022 v. 37 n. 6
100 _aChen, Yu.
_eauthor.
_953861
245 _aThermal mitigation and optimization via multitier bond wire layout for IGBT modules considering multicellular electro-thermal effect /
_cYu Chen, Qiang Wu, Chengmin Li, Haoze Luo, Yuanye Xia, Qinqin Yin, Wuhua Li, and Xiangning He.
260 _aNew York ;
_bThe Institute of Electrical and Electronics Engineers, Inc. ,
_cJune 2022.
300 _aVolume 37, pages 7299-7314 :
_billustration ;
_c29 cm.
500 _aIEEE Transactions on Power Electronics, vol. 37, no. 6, pages 7299-7314, June 2022.
700 _aChen, Yu.
_eauthor.
_953861
700 _aWu, Qiang.
_eauthor.
_953862
700 _aLi, Chengmin.
_eauthor.
_953863
700 _aLuo, Haoze.
_eauthor.
_953864
700 _aXia, Yuanye.
_eauthor.
_953865
700 _aYin, Qinqin.
_eauthor.
_953866
700 _aLi, Wuhua.
_eauthor.
_953867
700 _aHe, Xiangning.
_eauthor.
_953868
942 _2ddc
_cPER
999 _c19495
_d19495