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040 _c0
082 _aDPer 621.317 Ie21 June 2022 v. 37 n. 6
100 _aChen, Chuantong.
_eauthor.
_953579
245 _aInterface-mechanical and thermal characteristics of Ag sinter joining on bare DBA substrate during aging, thermal shock and 1200 W/cm² power cycling tests /
_cChuantong Chen, Dongjin Kim, Zheng Zhang, Naoki Wakasugi, Yang Liu, Ming-Chun Hsieh, Shuajie Zhao, Aiji Suetake, and Katsuaki Suganuma.
260 _aNew York ;
_bThe Institute of Electrical and Electronics Engineers, Inc. ,
_cJune 2022.
300 _aVolume 37, pages 6647-6659 :
_billustration ;
_c29 cm.
500 _aIEEE Transactions on Power Electronics, vol. 37, no. 6, pages 6647-6659, June 2022.
700 _aChen, Chuantong.
_eauthor.
_953579
700 _aKim, Dongjin.
_eauthor.
_953580
700 _aZhang, Zheng.
_eauthor.
_953581
700 _aWakasugi, Naoki.
_eauthor.
_953582
700 _aLiu, Yang.
_eauthor.
_953583
700 _aHsieh, Ming-Chun.
_eauthor.
_953584
700 _aZhao, Shuajie.
_eauthor.
_953585
700 _aSuetake, Aiji.
_eauthor.
_953586
700 _aSuganuma, Katsuaki.
_eauthor.
_953587
942 _2ddc
_cPER
999 _c19415
_d19415