| 000 | 01140nam a22002657a 4500 | ||
|---|---|---|---|
| 003 | OSt | ||
| 005 | 20250911162833.0 | ||
| 008 | 240221b ||||| |||| 00| 0 eng d | ||
| 040 | _c0 | ||
| 082 | _aDPer 621.317 Ie21 May 2022 v. 37 n. 5 | ||
| 100 |
_aWang, Xiao. _eauthor. _952828 |
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| 245 |
_aThermal contact resistance optimization of press-pack IGBT device based on liquid metal thermal interface material / _cXiao Wang, Hui Li, Ran Yao, Wei Lai, Renkuan Liu, Renze Yu, Xianping Chen, and Jinyuan Li. |
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| 260 |
_aNew York ; _bThe Institute of Electrical and Electronics Engineers, Inc. , _cMay 2022. |
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| 300 |
_aVolume 37, pages 5411-5421 : _billustration ; _c28 cm. |
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| 500 | _aIEEE Transactions on Power Electronics, vol. 37, no. 5, pages 5411-5421, May 2022. | ||
| 700 |
_aWang, Xiao. _eauthor. _952828 |
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| 700 |
_aLi, Hui. _eauthor. _952829 |
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| 700 |
_aYao, Ran. _eauthor. _952830 |
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| 700 |
_aLai, Wei. _eauthor. _952831 |
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| 700 |
_aLiu, Renkuan. _eauthor. _952832 |
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| 700 |
_aYu, Renze. _eauthor. _952833 |
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| 700 |
_aChen, Xianping. _eauthor. _952834 |
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| 700 |
_aLi, Jinyuan. _eauthor. _952835 |
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| 942 |
_2ddc _cPER |
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| 999 |
_c19243 _d19243 |
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