| 000 | 01041nam a22002417a 4500 | ||
|---|---|---|---|
| 999 |
_c19062 _d19062 |
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| 003 | OSt | ||
| 005 | 20240208152735.0 | ||
| 008 | 240208b ||||| |||| 00| 0 eng d | ||
| 040 | _c0 | ||
| 082 | _aDPer 621.317 Ie21 April 2022 v.37 n. 4 | ||
| 100 |
_aWang, Jianpeng. _eauthor. _952109 |
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| 245 |
_aA novel approach to model and analyze uneven temperature distribution among multichip high-power modules and corresponding method to respecify device SOA / _cJianpeng Wang, Wenjie Chen, Jin Zhang, Meng Xu, Laili Wang, Jinjun Liu, and Yongmei Gan |
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| 260 |
_aNew York; _bThe Institute of Electrical and Electronics Engineers, Inc., _c April 2022. |
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| 300 |
_avolume 37, _bpages 4626-4640, _cillustration. |
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| 700 |
_aWang, Jianpeng. _eauthor. _952109 |
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| 700 |
_aChen, Wenjie. _eauthor. _952110 |
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| 700 |
_aZhang, Jin. _eauthor. _952111 |
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| 700 |
_aXu, Meng. _eauthor. _952112 |
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| 700 |
_aWang, Laili. _eauthor. _952113 |
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| 700 |
_aLiu, Jinjun. _eauthor. _952114 |
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| 700 |
_aGan, Yongmei. _eauthor. _952115 |
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| 942 |
_2ddc _cPER |
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