000			01156nam a22002537a 4500
003			OSt
005			20250912170644.0
008			240208b ||||| |||| 00| 0 eng d
040			_c0000
082			_aDPer 621.381 In821 April 2022 v. 37 n. 4
100			_aWang, Jianpeng. _eauthor. _952102
245			_aA novel approach to model and analyze uneven temperature distribution among multichip high-power modules and corresponding method to respecify device SOA / _cJianpeng Wang, Wenjie Chen, Jin Zhang, Meng Xu, Laili Wang, Jinjun Liu, and Yongmei Gan.
260			_aNew York ; _bThe Institute of Electrical and Electronics Engineers, Inc. , _c April 2022.
300			_aVolume 37, pages 4626-4640 : _billustration ; _c28 cm.
500			_aIEEE Transaction on Power Electronics, vol. 37, no. 4, pages 4626-4640, April 2022.
700			_aWang, Jianpeng. _eauthor. _952102
700			_aChen, Wenjie. _eauthor. _952103
700			_aZhang, Jin. _eauthor. _952104
700			_aXu, Meng. _eauthor. _952105
700			_aWang, Laili. _eauthor. _952106
700			_aLiu, Jinjun. _eauthor. _952107
700			_aGan, Yongmei. _eauthor. _952108
942			_2ddc _cPER
999			_c19061 _d19061