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Chip-level electrothermal stress calculation method of high-power IGBT modules in system-level simulation / Jianpeng Wang, Wenjie Chen, Yuwei Wu, Jin Zhang, Laili Wang, and Jinjun Liu. by
Material type: Text Text; Format: print ; Literary form: Not fiction
Publication details: New York ; The Institute of Electrical and Electronics Engineers, Inc. , September 2022
Availability: Items available for reference: UM Digos College - LIC: Not for loan (1)Call number: DPer 621.381 In821 September 2022 v. 37 n. 9.

2.
Comparison and optimization of datasheet-driven extraction og gate-drain overlap oxide capacitance in igbt modeling / Yuwei Wu, Laili Wang, Jianpeng Wang, Zenan Shi, and Jin Zhang. by
Material type: Text Text; Format: print ; Literary form: Not fiction
Publication details: New York ; The Institute of Electrical and Electronics Engineers, Inc., December 2022
Availability: Items available for reference: UM Digos College - LIC: Not for loan (1)Call number: DPer 621.317 Ie21part 1&2 December 2022 v.37 n. 12. .

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