A novel approach to model and analyze uneven temperature distribution among multichip high-power modules and corresponding method to respecify device SOA / Jianpeng Wang, Wenjie Chen, Jin Zhang, Meng Xu, Laili Wang, Jinjun Liu, and Yongmei Gan
Material type:
TextPublication details: New York; The Institute of Electrical and Electronics Engineers, Inc., April 2022.Description: volume 37, pages 4626-4640, illustrationDDC classification: - DPer 621.317 Ie21 April 2022 v.37 n. 4
| Item type | Current library | Collection | Call number | Status | Notes | Date due | Barcode | |
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Periodicals
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UM Digos College - LIC | Periodicals | DPer 621.317 Ie21 April 2022 v.37 n. 4 (Browse shelf(Opens below)) | Not for loan | Periodical Article |
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