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A novel approach to model and analyze uneven temperature distribution among multichip high-power modules and corresponding method to respecify device SOA / Jianpeng Wang, Wenjie Chen, Jin Zhang, Meng Xu, Laili Wang, Jinjun Liu, and Yongmei Gan

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TextPublication details: New York; The Institute of Electrical and Electronics Engineers, Inc., April 2022.Description: volume 37, pages 4626-4640, illustrationDDC classification:

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