TY  - BOOK
AU  - Zhang, Zichen.
AU  - Zhang, Zichen.
AU  -  Lu, Shengchang.
AU  - Wang, Boyan.
AU  - Zhang, Yuhao.
AU  - Yun, Nick.
AU  - Sung, Woongji.
AU  - Ngo, Khai d.t. 
AU  - Lu, Guo-Quan. 
TI  - Packaging of 10-k v double-side cooled silicon carbide diode modular with tin substarates coated by a  nonlinear resistive polymer-nanoparticle composite
U1  - DPer 621.317 Ie21 December 2022 v.37 n. 12 part 1&2. 
PY  - 2022///
CY  - New York ; 
PB  - The Institute of Electrical and Electronics Engineers, Inc., 
KW  - Module thermal management and insulation
KW  - Substrates
KW  - polymer-nanoparticle composite
N1  - IEEE Transactions on Power Electronics, v. 37 n. 12, pages 14462-14470, December 2022.
ER  -