Packaging of 10-k v double-side cooled silicon carbide diode modular with tin substarates coated by a nonlinear resistive polymer-nanoparticle composite - Zhang, Zichen; Zhang, Zichen; Lu, Shengchang; Wang, Boyan; Zhang, Yuhao; Yun, Nick.; Sung, Woongji; Ngo, Khai d.t.; Lu, Guo-Quan. (New York ; The Institute of Electrical and Electronics Engineers, Inc., 2022)
IEEE Transactions on Power Electronics, v. 37 n. 12, pages 14462-14470, December 2022.
Keywords: Module thermal management and insulation; Substrates; polymer-nanoparticle composite