TY  - BOOK
AU  - Kuring, Carsten.
AU  - Kuring, Carsten.
AU  - Wolf, Michaela.
AU  - Geng, Xiaomeng.
AU  - Hilt, Oliver.
AU  - Böcker, Jan.
AU  - Würfl, Joachim.
AU  - Dieckerhoff, Sibylle.
TI  - GaN-based multichip half-bridge power module integrated on high-voltage AIN ceramic substrate
U1  - DPer 621.317 Ie21 October 2022 v. 37 n. 10 
PY  - 2022///
CY  - New York ; 
PB  - The Institute of Electrical and Electronics Engineers, Inc. , 
N1  - IEEE Transactions on Power Electronics, v. 37, n. 10, pages 11896-11910, October 2022
ER  -