GaN-based multichip half-bridge power module integrated on high-voltage AIN ceramic substrate /
Carsten Kuring, Michaela Wolf, Xiaomeng Geng, Oliver Hilt, Jan Böcker, Joachim Würfl, and Sibylle Dieckerhoff.
- New York ; The Institute of Electrical and Electronics Engineers, Inc. , October 2022.
- Volume 37, pages 11896-11910 : illustration ; 28 cm.
IEEE Transactions on Power Electronics, v. 37, n. 10, pages 11896-11910, October 2022.