TY  - BOOK
AU  - Xu, Mengqi.
AU  - Xu, Mengqi.
AU  - Ma, Ke.
AU  - Cai, Xu.
AU  - Cao, Gongzheng.
AU  - Zhang, Yhalin.
TI  - Lumped thermal coupling model of multichip power module enabling case temperature as reference node
U1  - DPer 621.381 Ie21 October 2022 v. 37 n. 10 
PY  - 2022///
CY  - New York ; 
PB  - The Institute of Electrical and Electronics Engineers, Inc. , 
N1  - IEEE Transactions on Power Electronics, v. 37, n. 10, pages 11502-11506, October 2022
ER  -