Xu, Mengqi. <br/><br/>
Lumped thermal coupling model of multichip power module enabling case temperature as reference node / 
Mengqi Xu, Ke Ma, Xu Cai, Gongzheng Cao, and Yhalin Zhang. 
 - New York ;   The Institute of Electrical and Electronics Engineers, Inc. ,   October 2022. 
 - Volume 37, pages 11502-11506 :  illustration ;  28 cm. 
<br/><br/> IEEE Transactions on Power Electronics, v. 37, n. 10, pages 11502-11506, October 2022. 
<br/><br/><label>Dewey Class. No.: </label>DPer 621.381 Ie21 October 2022 v. 37 n. 10