TY  - BOOK
AU  - Wang, Jianpeng.
AU  - Wang, Jianpeng.
AU  - Chen, Wenjie.
AU  - Wu, Yuwei.
AU  - Zhang, Jin.
AU  - Wang, Laili.
AU  - 
TI  - Chip-level electrothermal stress calculation method of high-power IGBT modules in system-level simulation
U1  - DPer 621.381 In821 September 2022 v. 37 n. 9 
PY  - 2022///
CY  - New York ; 
PB  - The Institute of Electrical and Electronics Engineers, Inc. , 
N1  - IEEE Transitions on Power Electronics, v. 37 n. 9, pages 10546-10561, September 2022
ER  -