Wang, Jianpeng. <br/><br/>
Chip-level electrothermal stress calculation method of high-power IGBT modules in system-level simulation / 
Jianpeng Wang, Wenjie Chen, Yuwei Wu, Jin Zhang, Laili Wang, and Jinjun Liu. 
 - New York ;   The Institute of Electrical and Electronics Engineers, Inc. ,   September 2022. 
 - Volume 37, pages 10546-10561 :  illustration ;  28 cm. 
<br/><br/> IEEE Transitions on Power Electronics, v. 37 n. 9, pages 10546-10561, September 2022. 
<br/><br/><label>Dewey Class. No.: </label>DPer 621.381 In821 September 2022 v. 37 n. 9