TY  - BOOK
AU  - Li, Xiao-Di.
AU  - Li, Xiao-Di.
AU  - Lu, Guo-Quan.
AU  - Mei, Yun-Hui.
TI  - Reliable aluminum wire-bonded SiC/Si diodes with laminated Al/Cu stress buffers
U1  - DPer 621.381 In821 September 2022 v. 37 n. 9 
PY  - 2022///
CY  - New York ; 
PB  - The Institute of Electrical and Electronics Engineers, Inc. , 
N1  - IEEE Transitions on Power Electronics, v. 37 n. 9, pages 10149-10153, September 2022
ER  -