Li, Xiao-Di. <br/><br/>
Reliable aluminum wire-bonded SiC/Si diodes with laminated Al/Cu stress buffers / 
Xiao-Di Li, Guo-Quan Lu, and Yun-Hui Mei. 
 - New York ;   The Institute of Electrical and Electronics Engineers, Inc. ,   September 2022. 
 - Volume 37, pages 10149-10153 :  illustration ;  28 cm. 
<br/><br/> IEEE Transitions on Power Electronics, v. 37 n. 9, pages 10149-10153, September 2022. 
<br/><br/><label>Dewey Class. No.: </label>DPer 621.381 In821 September 2022 v. 37 n. 9