TY  - BOOK
AU  - Hu, Zed.ng 
AU  - Hu, Zedong 
AU  - Hu, Borong.
AU  - Ran, Li.
AU  - Tavner, Peter J. 
AU  - Kong, Hua.
AU  - Mawby, Philip A. 
AU  - Wu, Ruizhu.
TI  - Monitoring power module solder degradation from heat dissipation in two opposite directions
U1  - DPer 621.381 In821 August 2022 v. 37 n. 8 
PY  - 2022///
CY  - New York ; 
PB  - The Institute of Electrical and Electronics Engineers, Inc. , 
N1  - IEEE Transitions on Power Electronics, v. 37 n. 8, pages 9754-9766, August 2022
ER  -