Hu, Zed.ng  <br/><br/>
Monitoring power module solder degradation from heat dissipation in two opposite directions / 
Zedong Hu, Borong Hu, Li Ran, Peter J. Tavner, Hua Kong, Philip A. Mawby, and Ruizhu Wu. 
 - New York ;   The Institute of Electrical and Electronics Engineers, Inc. ,   August 2022. 
 - Volume 37, pages 9754-9766 :  illustration ;  28 cm. 
<br/><br/> IEEE Transitions on Power Electronics, v. 37 n. 8, pages 9754-9766, August 2022. 
<br/><br/><label>Dewey Class. No.: </label>DPer 621.381 In821 August 2022 v. 37 n. 8