TY  - BOOK
AU  - Chen, Jie.
AU  - Chen, Jie.
AU  - Deng, Erping.
AU  - Zhang, Yiming.
AU  - Huang, Yongzhang.
TI  - Junction-to-case thermal resistance measurement and analysis of press-pack IGBTs under double-side cooling condition
U1  - DPer 621.317 Ie21 July 2022 v. 37 n. 7 
PY  - 2022///
CY  - New York
PB  - The Institute of Electrical and Electronics Engineers, Inc. , 
N1  - IEEE Transactions on Power Electronics, vol. 37, no. 7, pages 8543-8553, July 2022
ER  -