Chen, Jie. <br/><br/>
Junction-to-case thermal resistance measurement and analysis of press-pack IGBTs under double-side cooling condition  / 
Jie Chen, Erping Deng, Yiming Zhang, and Yongzhang Huang.  
 - New York ;  The Institute of Electrical and Electronics Engineers, Inc. ,   July 2022. 
 - volume 37, pages 8543-8553 :  illustration ;  28 cm. 
<br/><br/> IEEE Transactions on Power Electronics, vol. 37, no. 7, pages 8543-8553, July 2022. 
<br/><br/><label>Dewey Class. No.: </label>DPer 621.317 Ie21 July 2022 v. 37 n. 7