TY  - BOOK
AU  - Wang, Laili.
AU  - Wang, Laili.
AU  - Zhang, Tongyu.
AU  - Yang, Fengtao.
AU  - Ma, Dingkun.
AU  - Zhao, Cheng.
AU  - Pei, Yunqing.
AU  - Gan, Yongmei.
TI  - Cu clip-bonding method with optimized source inductance for current balancing in multichip MOSFET power module
U1  - DPer 621.317 Ie21 July 2022 v. 37 n. 7 
PY  - 2022///
CY  - New York ; 
PB  - The Institute of Electrical and Electronics Engineers, Inc.
N1  - IEEE Transactions on Power Electronics, vol. 37, no. 7, pages 7952-7964, July 2022
ER  -