Wang, Laili. <br/><br/>
Cu clip-bonding method with optimized source inductance for current balancing in multichip MOSFET power module / 
Laili Wang, Tongyu Zhang, Fengtao Yang, Dingkun Ma, Cheng Zhao, Yunqing Pei, and Yongmei Gan. 
 - New York ;   The Institute of Electrical and Electronics Engineers, Inc. ,  July 2022. 
 - volume 37, pages 7952-7964 :  illustration ;  28 cm. 
<br/><br/> IEEE Transactions on Power Electronics, vol. 37, no. 7, pages 7952-7964, July 2022. 
<br/><br/><label>Dewey Class. No.: </label>DPer 621.317 Ie21 July 2022 v. 37 n. 7