Interface-mechanical and thermal characteristics of Ag sinter joining on bare DBA substrate during aging, thermal shock and 1200 W/cm² power cycling tests /
Chuantong Chen, Dongjin Kim, Zheng Zhang, Naoki Wakasugi, Yang Liu, Ming-Chun Hsieh, Shuajie Zhao, Aiji Suetake, and Katsuaki Suganuma.
- New York ; The Institute of Electrical and Electronics Engineers, Inc. , June 2022.
- Volume 37, pages 6647-6659 : illustration ; 29 cm.
IEEE Transactions on Power Electronics, vol. 37, no. 6, pages 6647-6659, June 2022.