Improved measurement accuracy for junction-to-case thermal resistance of Gan HEMT packages by gate-to-gate electrical interface materials - Lu, Shengchang; Lu, Shengchang; Zhang, Zichen; Buttay, Cyril; Ngo, Khai D. T.; Lu, Guo-Quan. (New York ; The Institute of Electrical and Electronics Engineers, Inc., 2022)
IEEE Transactions on Power Electronics, vol. 37, no. 6, pages 6285-6289, June 2022.