Lu, Shengchang. <br/><br/>
Improved measurement accuracy for junction-to-case thermal resistance of Gan HEMT packages by gate-to-gate electrical interface materials / 
Shengchang Lu, Zichen Zhang, Cyril Buttay, Khai D. T. Ngo, and Guo-Quan Lu. 
 - New York ;   The Institute of Electrical and Electronics Engineers, Inc. ,   June 2022. 
 - Volume 37, pages 6285-6289 :  illustration ;  29 cm. 
<br/><br/> IEEE Transactions on Power Electronics, vol. 37, no. 6, pages 6285-6289, June 2022. 
<br/><br/><label>Dewey Class. No.: </label>DPer 621.317 Ie21 June 2022 v. 37 n. 6