TY  - BOOK
AU  - Wang, Xiao.
AU  - Wang, Xiao.
AU  - Li, Hui.
AU  - Yao, Ran.
AU  - Lai, Wei.
AU  - Liu, Renkuan.
AU  - Yu, Renze.
AU  - Chen, Xianping.
AU  - Li, Jinyuan.
TI  - Thermal contact resistance optimization of press-pack IGBT device based on liquid metal thermal interface material
U1  - DPer 621.317 Ie21 May 2022 v. 37 n. 5 
PY  - 2022///
CY  - New York ; 
PB  - The Institute of Electrical and Electronics Engineers, Inc.
N1  - IEEE Transactions on Power Electronics, vol. 37, no. 5, pages 5411-5421, May 2022
ER  -