Wang, Xiao. <br/><br/>
Thermal contact resistance optimization of press-pack IGBT device based on liquid metal thermal interface material / 
Xiao Wang, Hui Li, Ran Yao, Wei Lai, Renkuan Liu, Renze Yu, Xianping Chen, and Jinyuan Li. 
 - New York ;   The Institute of Electrical and Electronics Engineers, Inc. ,  May 2022. 
 - Volume 37, pages 5411-5421 :  illustration ;  28 cm. 
<br/><br/> IEEE Transactions on Power Electronics, vol. 37, no. 5, pages 5411-5421, May 2022. 
<br/><br/><label>Dewey Class. No.: </label>DPer 621.317 Ie21 May 2022 v. 37 n. 5