Mu, Wei. <br/><br/>
Direct integration of optimized phase-change heat spreaders into SiC power module for thermal performance improvements under high heat flux / 
Wei Mu, Laili Wang, Binyu Wang, Tongyu Zhang, Fengtao Yao, Yongmei Gan, and Hong Zhang. 
 - New York ;   The Institute of Electrical and Electronics Engineers, Inc. ,   May 2022. 
 - Volume 37, pages 5398-5410 :  illustration ;  28 cm. 
<br/><br/> IEEE Transactions on Power Electronics, vol. 37, no. 5, pages 5398-5410, May 2022. 
<br/><br/><label>Dewey Class. No.: </label>DPer 621.317 Ie21 May 2022 v. 37 n. 5