A novel approach to model and analyze uneven temperature distribution among multichip high-power modules and corresponding method to respecify device SOA - Wang, Jianpeng; Wang, Jianpeng; Chen, Wenjie; Zhang, Jin.; Xu, Meng.; Wang, Laili; Liu, Jinjun; Gan, Yongmei (New York; The Institute of Electrical and Electronics Engineers, Inc., 2022)