Wang, Jianpeng. <br/><br/>
A novel approach to model and analyze uneven temperature distribution among multichip high-power modules and corresponding method to respecify device SOA / 
Jianpeng Wang, Wenjie Chen, Jin Zhang, Meng Xu, Laili Wang, Jinjun Liu, and Yongmei Gan 
 - New York;   The Institute of Electrical and Electronics Engineers, Inc.,   April 2022. 
 - volume 37,   pages 4626-4640,   illustration. 
<br/><br/><label>Dewey Class. No.: </label>DPer 621.317 Ie21 April 2022 v.37 n. 4