TY  - BOOK
AU  - Wang, Jianpeng.
AU  - Wang, Jianpeng.
AU  - Chen, Wenjie.
AU  - Zhang, Jin.
AU  - Xu, Meng.
AU  - Wang, Laili.
AU  - Liu, Jinjun.
AU  - Gan, Yongmei.
TI  - A novel approach to model and analyze uneven temperature distribution among multichip high-power modules and corresponding method to respecify device SOA
U1  - DPer 621.381 In821 April 2022 v. 37 n. 4 
PY  - 2022///
CY  - New York ; 
PB  - The Institute of Electrical and Electronics Engineers, Inc.
N1  - IEEE Transaction on Power Electronics, vol. 37, no. 4, pages 4626-4640, April 2022
ER  -