Wang, Jianpeng. <br/><br/>
A novel approach to model and analyze uneven temperature distribution among multichip high-power modules and corresponding method to respecify device SOA / 
Jianpeng Wang, Wenjie Chen, Jin Zhang, Meng Xu, Laili Wang, Jinjun Liu, and Yongmei Gan. 
 - New York ;   The Institute of Electrical and Electronics Engineers, Inc. ,   April 2022. 
 - Volume 37, pages 4626-4640 :  illustration ;  28 cm. 
<br/><br/> IEEE Transaction on Power Electronics, vol. 37, no. 4, pages 4626-4640, April 2022. 
<br/><br/><label>Dewey Class. No.: </label>DPer 621.381 In821 April 2022 v. 37 n. 4