GaN-based multichip half-bridge power module integrated on high-voltage AIN ceramic substrate / Carsten Kuring, Michaela Wolf, Xiaomeng Geng, Oliver Hilt, Jan Böcker, Joachim Würfl, and Sibylle Dieckerhoff.
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TextPublication details: New York ; The Institute of Electrical and Electronics Engineers, Inc. , October 2022.Description: Volume 37, pages 11896-11910 : illustration ; 28 cmDDC classification: - DPer 621.317 Ie21 October 2022 v. 37 n. 10
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UM Digos College - LIC | Periodicals | DPer 621.317 Ie21 October 2022 v. 37 n. 10 (Browse shelf(Opens below)) | Not for loan | Periodical Article |
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IEEE Transactions on Power Electronics, v. 37, n. 10, pages 11896-11910, October 2022.
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