Interface-mechanical and thermal characteristics of Ag sinter joining on bare DBA substrate during aging, thermal shock and 1200 W/cm² power cycling tests / Chuantong Chen, Dongjin Kim, Zheng Zhang, Naoki Wakasugi, Yang Liu, Ming-Chun Hsieh, Shuajie Zhao, Aiji Suetake, and Katsuaki Suganuma.
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TextPublication details: New York ; The Institute of Electrical and Electronics Engineers, Inc. , June 2022.Description: Volume 37, pages 6647-6659 : illustration ; 29 cmDDC classification: - DPer 621.317 Ie21 June 2022 v. 37 n. 6
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Periodicals
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UM Digos College - LIC | Periodicals | DPer 621.317 Ie21 June 2022 v.37 n. 6 (Browse shelf(Opens below)) | Not for loan | Periodical Article |
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IEEE Transactions on Power Electronics, vol. 37, no. 6, pages 6647-6659, June 2022.
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