Reliable aluminum wire-bonded SiC/Si diodes with laminated Al/Cu stress buffers /
Li, Xiao-Di.
Reliable aluminum wire-bonded SiC/Si diodes with laminated Al/Cu stress buffers / Xiao-Di Li, Guo-Quan Lu, and Yun-Hui Mei. - New York ; The Institute of Electrical and Electronics Engineers, Inc. , September 2022. - Volume 37, pages 10149-10153 : illustration ; 28 cm.
IEEE Transitions on Power Electronics, v. 37 n. 9, pages 10149-10153, September 2022.
DPer 621.381 In821 September 2022 v. 37 n. 9
Reliable aluminum wire-bonded SiC/Si diodes with laminated Al/Cu stress buffers / Xiao-Di Li, Guo-Quan Lu, and Yun-Hui Mei. - New York ; The Institute of Electrical and Electronics Engineers, Inc. , September 2022. - Volume 37, pages 10149-10153 : illustration ; 28 cm.
IEEE Transitions on Power Electronics, v. 37 n. 9, pages 10149-10153, September 2022.
DPer 621.381 In821 September 2022 v. 37 n. 9