Junction-to-case thermal resistance measurement and analysis of press-pack IGBTs under double-side cooling condition /
Chen, Jie.
Junction-to-case thermal resistance measurement and analysis of press-pack IGBTs under double-side cooling condition / Jie Chen, Erping Deng, Yiming Zhang, and Yongzhang Huang. - New York ; The Institute of Electrical and Electronics Engineers, Inc. , July 2022. - volume 37, pages 8543-8553 : illustration ; 28 cm.
IEEE Transactions on Power Electronics, vol. 37, no. 7, pages 8543-8553, July 2022.
DPer 621.317 Ie21 July 2022 v. 37 n. 7
Junction-to-case thermal resistance measurement and analysis of press-pack IGBTs under double-side cooling condition / Jie Chen, Erping Deng, Yiming Zhang, and Yongzhang Huang. - New York ; The Institute of Electrical and Electronics Engineers, Inc. , July 2022. - volume 37, pages 8543-8553 : illustration ; 28 cm.
IEEE Transactions on Power Electronics, vol. 37, no. 7, pages 8543-8553, July 2022.
DPer 621.317 Ie21 July 2022 v. 37 n. 7