Cu clip-bonding method with optimized source inductance for current balancing in multichip MOSFET power module / Laili Wang, Tongyu Zhang, Fengtao Yang, Dingkun Ma, Cheng Zhao, Yunqing Pei, and Yongmei Gan.
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TextPublication details: New York ; The Institute of Electrical and Electronics Engineers, Inc. , July 2022.Description: volume 37, pages 7952-7964 : illustration ; 28 cmDDC classification: - DPer 621.317 Ie21 July 2022 v. 37 n. 7
| Item type | Current library | Collection | Call number | Status | Notes | Date due | Barcode | |
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Periodicals
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UM Digos College - LIC | Periodicals | DPer 621.317 Ie21 July 2022 v. 37 n. 7 (Browse shelf(Opens below)) | Not for loan | Periodical Article |
IEEE Transactions on Power Electronics, vol. 37, no. 7, pages 7952-7964, July 2022.
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