A novel approach to model and analyze uneven temperature distribution among multichip high-power modules and corresponding method to respecify device SOA / Jianpeng Wang, Wenjie Chen, Jin Zhang, Meng Xu, Laili Wang, Jinjun Liu, and Yongmei Gan.
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TextPublication details: New York ; The Institute of Electrical and Electronics Engineers, Inc. , April 2022.Description: Volume 37, pages 4626-4640 : illustration ; 28 cmDDC classification: - DPer 621.381 In821 April 2022 v. 37 n. 4
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IEEE Transaction on Power Electronics, vol. 37, no. 4, pages 4626-4640, April 2022.
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